Wafer Detachment Device DB12T
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.
- Company：ズース・マイクロテック
- Price：Other
